ASICs (Application Specific Integrated Circuit)

An Integrated circuit (IC) customized for a particular use and not for general use is called an Application-Specific Integrated Circuit (ASIC). An example of this is a chip which is designed only to run a cell phone. Whereas there are 7400 series and 4000 series integrated circuits as logic building blocks which can be wired together and used in various applications. There are also Application Specific Standard Products (ASSPs) which are intermediate between application specific integrated circuits (ASIC) and standard products.

Application specific integrated circuits (ASICs) can consolidate the work of many chips into a single, smaller, faster package, reducing manufacturing and support costs while boosting the speed of the device built with them. Application specific integrated circuits (ASICs) technology is now so advanced that many functions traditionally implemented in software can be migrated to Application Specific Integrated Circuits (ASICs).

Designers prefer using application specific integrated circuits as it lets them use the power of constantly improving silicon technology to build devices targeted at specific functions, such as routing. Performance improvements of up to threefold can be achieved through the use of application specific integrated circuits (ASIC) when compared with the same functions being executed in software.

Engineers are in constant strain to adjudicate the right application specific integrated circuits (ASICs) that will confer to the need and requirements of their design. Since many manufacturers and brands of Application Specific Integrated Circuits (ASIC) are available for online sale, criticality of selection of the right component gets amplified. What they need is a comprehensive website developed to give them a holistic view of every application specific integrated circuits (ASICs) available.  

The landslide preference of application specific integrated circuits (ASICs) compared to the normal ICs available in the market needs the manufacturers, suppliers and distributors to develop and market their application specific integrated circuits (ASICs) product line with fueled aggression. Mere aggression and marketing strategies would fall flat on face if it’s cemented over a cracked surface of network. The most prominent lubrication of successful customer-seller relationship is network; until and unless you have a strong widespread network of manufacturers, supplier, distributors and representatives, the customers will always be at least a decimal point unsatisfied with your organization.

We know that none of you would want to risk the opportunity to develop long-lasting corporate relationship; as much as the engineers would not like to gamble with the critical needs of procuring the best quality components from you.

ASICs are built to suit need specific application needs; hence we have three broad varieties of ASICs with us:

1. Cell Based Application Specific Integrated Circuits (ASICS)
These feature rich, high-density cell-based ASICs are needed in your high-volume projects. We provide the options needed for high performance system-level integration with leading ASIC process technology and embedded DRAM.

Benefits:

• Highest performance, power and integration
• Cell-based ASICs are offered with a selection of IP cores.
• Perfect for high-volume designs that require the highest density and performance.
• available in a range of process technologies
• Max. clock speed: Up to 1 GHz
• Memory: High-density SRAM and embedded DRAM
• Signal I/Os: Up to 1400
• Usable ASIC gates: Up to 100M
• Featured IP: ARM CPUs, Tensilica CPUs and DSPs, USB 2.0, eDRAM, SerDes, PCI Express, SATA/SAS, SPI4.2

IP Core
There are a large number of IP cores in cell-based ICs, including CPU cores and analog logic cores. Customers are supported in their own system chip design development by these options. Some of the cores available with us are listed below.
Core List

• Digital Core
• Analog Core
• SRAM
• eDRAM
• I/O

Services Provided During Cell-Based IC Development
Linked processes from logic design to manufacturing features in production of cell-based ICs helps in providing an environment for short turnaround time in mass-producing large-scale integration, advanced performance, and low power consumption.

Benefits:

• Logic design taking layout design into account at an early stage
• Layout design taking manufacturing (DFY or DFM) into account
• Test design improving manufacturing quality
• Feedback from manufacturing to logic design and test design

2. Gate Array & Embedded Array ASICs
Gate arrays help reduce the cost, turnaround time and risk while improving power consumption, EMI and performance. These arrays, based on a sea-of-gates architecture, which is customized using only the metallization layers for interconnect. Low NRE costs and fast turnaround time are its results.
The manufacturers of GATE ARRAY &EMBEDDED AREEAY ASICs listed on our website has been the worldwide leader in gate arrays since 1993, with over 200 tape outs each year.

Highlights:

• From the #1 supplier worldwide, with over 750 tape-outs over the past 3 years
• Low price, low NRE cost (as low as $10,000), easy-to-design option, easy Logic consolidation due to small gate counts and small package design.
• FPGA-compatible packages also available. In just nine short days from tape out, we can have engineering samples ready to go.
• Max. clock speed: 133 MHz
• Memory: Diffused and metallized SRAM
• Signal I/Os: From 20 to 876
• Usable ASIC Gates: From 1.5K to 1.6M
• Featured IP: DMA controller, interrupt controller, PCI controller, DPLL, UART, timer, parallel interface unit, UART + FIFO, Tensilica CPUs and DSPs
• Master slices: 158

3. EDRAM Application Specific Integrated Circuits (ASICS)
We are associated with the leaders of the eDRAM ASICs producers and manufacturers. This gives you only the best and most preferred components in the electronic industry. Following are some of the features that make eDRAM, the ideal solution for a wide variety of applications.

• Random access time an order of magnitude shorter than competitor offerings
• Fully CMOS-compatible process using a single fab and few extra masks to minimize cost
• SRAM-like access for easy integration with existing intellectual property (IP)
• SoC-friendly macros that simplify integration, with orientation in any direction and over-the-top routing
• The latest 55 nm family, which adds significant process enhancements to the improved materials that have proven so successful in our previous 90 nm family

Applications
These characteristics have helped fuel the growing popularity of eDRAM for a variety of applications – from communications systems to home electronics, from enterprise servers to entertainment systems. The success complex system LSI chip for the Nintendo Wii™ and Microsoft® XBox 360™ has propelled fabrication volume to many millions of devices.